More 3G Interoperability With Japan
Last week, we noticed that DoCoMo and Ericsson had completed interoperability testing between Ericsson’s W-CDMA chipset and DoCoMo’s FOMA network. Today, Qualcomm and DoCoMo have announced successful interop testing between the QCOMM MSM6250 W-CDMA chipset and the FOMA network. This increases the global roaming usefulness of 3G networks, and now we’re really just waiting for other chipmakers to make similar announcements. TI?
Filed Under: 3g