More 3G Interoperability With Japan

Last week, we noticed that DoCoMo and Ericsson had completed interoperability testing between Ericsson’s W-CDMA chipset and DoCoMo’s FOMA network. Today, Qualcomm and DoCoMo have announced successful interop testing between the QCOMM MSM6250 W-CDMA chipset and the FOMA network. This increases the global roaming usefulness of 3G networks, and now we’re really just waiting for other chipmakers to make similar announcements. TI?

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